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Micro Electrical Discharge Machining of Reaction-bonded Silicon Carbide (RB-SiC)

发布时间:2018-06-08 15:41:40 发布人:孙人杰  审核人:李天镇

报告题目:Micro Electrical Discharge Machining of Reaction-bonded Silicon Carbide (RB-SiC)

主 讲 人:Liew Pay Jun 博士

报告时间:2018年6月11日(周一)下午13:30-15:30

报告地点:轮机楼317会议室

报告简介:Micro-EDM is primarily an electro-thermal machining process for conductive material. However, the RB-SiC that was used in this study possesses very low conductivity, which made the machining process unstable. This problem becomes more pronounced during the fabrication of micro deep holes and other micro-structures such as micro dimples and micro grooves. Therefore, in this study, a new machining method, namely hybrid EDM process by combining ultrasonic cavitation and carbon nanofibers was proposed. In this method, suitable amount of carbon nanofibers were added and mixed uniformly in the dielectric fluid. Results show that ultrasonic vibration not only induces stirring effect, but also causes cloud cavitation effect which is helpful for removing debris and preventing tool material deposition on machined surface. As test pieces, micro-holes having 10 μm level diameters and high aspect ratios (21.7) were successfully fabricated on reaction-bonded silicon carbide in a few minutes. The hybrid EDM process combining ultrasonic cavitation and carbon nanofiber addition is demonstrated to be useful for fabricating microstructures on hard brittle ceramic materials.

此次报告Liew Pay Jun博士除了将与本校师生分享其相关科研内容外,还将介绍马来西亚马六甲科技大学的情况,欢迎感兴趣的广大师生参加。

主讲人简介:Liew Pay Jun博士现任教于马来西亚马六甲科技大学(Universiti Teknikal Malaysia Melaka (UTeM)机械工程系,并兼任该校国际合作与交流处副处长。2006年于Kolej Universiti Teknologi Tun Hussein Onn毕业,并于次年从Coventry University(UK)获得工学硕士学位,此后在Tohoku University(Japan)获得工学博士学位。其主要研究方向包括微米/纳米超微细加工,放电加工,纳米流体辅助加工技术,目前已发表高影响力国际期刊论文30篇,英文编著章节2篇。